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1. Selection of diamond particle size When the diamond particle size is coarse and single particle size, the saw segment is sharp and sawing efficiency, but the bending strength of diamond agglomeration decreases; when the diamond particle size is fine or coarse and fine particle size is mixed, the saw segment durability , but the efficiency is low. Considering the above factors, it is more appropriate to choose a diamond particle size of 50/60 mesh.

2. The choice of the diamond distribution concentration is within a certain range. When the diamond concentration changes from low to low, the sharpness and sawing efficiency of the saw blade gradually decrease, and the service life is gradually extended; but if the concentration is too high, the saw blade will become dull. With low concentration and coarse particle size, the efficiency will be improved.

Taking advantage of the different effects of various parts of the diamond segment during sawing, different concentrations are used (that is, a lower concentration can be used for the middle layer in a three-layer or more-layer structure). It is beneficial to prevent the saw blade from swaying, thereby improving the quality of stone processing.

3. Selection of diamond strength Diamond strength is an important indicator to ensure cutting performance.

Excessive strength will make the crystal not easy to break, the abrasive grains will be polished during use, and the sharpness will decrease, resulting in the deterioration of tool performance; when the diamond strength is not enough, it will be easily broken after being impacted, and it is difficult to undertake the heavy duty of cutting. Therefore, the strength should be selected at 130~ 140N.

4. The selection of the binder phase The performance of the saw blade does not only depend on the diamond, but on the overall performance of the composite material, the diamond segment formed by the proper coordination of the diamond and the binder.

For soft stones such as marble, the mechanical properties of the required section are relatively low, and copper-based binders can be used.

However, the copper-based binder has low sintering temperature, low strength and hardness, high toughness, and low bonding strength with diamond.

When tungsten carbide (WC) is added, WC or W2C is used as the framework metal, and an appropriate amount of cobalt is added to improve the strength, hardness and bonding characteristics, and a small amount of metals such as Cu, Sn, Zn, etc. with low melting point and low hardness are added for bonding. Phase. The particle size of the main additive component should be finer than 200 mesh, and the particle size of the additive component should be finer than 300 mesh.

5. The selection of sintering process As the temperature increases, the densification degree of the matrix increases, and the flexural strength also increases, and with the extension of the holding time, the flexural strength of the blank matrix and diamond agglomerates increases first and then If it is lower, you can choose to sinter at 800 ℃ for 120s to meet the performance requirements. The so-called price is what you get, but it does not mean that the expensive is necessarily good. The choice of diamond segment should still be selected according to the stone to be cut. Stone Selection.